RF Seminars

Fotofab is teaming up with Besser Associates, the world leader in RF and wireless education, to present a series of free courses in shielding techniques.  Besides their many years of work experience, Besser Associates' instructors are skilled teachers who are current on the latest technology and techniques—as well as fundamental principles. 

See below for a description of the course or read more about Besser Associates at http://www.besserassociates.com.

Upcoming courses are:

Irvine, CA – March 27th, 2008 – 1pm-5pm
Embassy Suites, Irvine, CA

2120 Main Street, Irvine, CA
Click here to reserve your spot!


Boston (Framingham), MA – Spring 2008

Each seminar is limited to 50 participants.

Questions? 
Contact Dan Sima
Phone: (773) 463-6211
Email:

Course Details
Today’s electronic systems are getting more and more complex, while components are getting smaller and smaller, with the result that interaction and coupling between components and between traces on the circuit board have increased dramatically. It is not practical to relocate components that couple nor is it practical to add extensive shielding to a circuit board that was designed without regard to the addition of compact metal or plastic shields. Other problems involving electromagnetic interference stem from the sharing of bypass capacitors, power busses and control lines. Techniques for modeling power supply coupling and simple tests for finding that coupling are shown.

EMI problems may begin with the packaging of complex components where coupling between the leads and ground bounce can limit high frequency performance. Careful grounding choices on the chip, in the package, and in its connection to the circuit board can minimize these problems. In this course we will try to address all of these issues and others suggested by the participants. The effects of perforations on shielding and techniques to minimize EMI leakage while permitting cooling will be demonstrated. Obtaining shielding effectiveness equivalent to multiple shields through specially shaped folded shields will be shown. Some integrated circuits will be used to demonstrate the effects of packaging techniques and ways to “un-share” grounds. Finally, some simple measurement techniques and probes are discussed.